From December 3rd to 5th, 2025, the HKPCA SHOW International Electronic Circuit (Shenzhen) Exhibition concluded successfully. Covering an exhibition area of 80,000 square meters, it set up nine themed exhibition zones, gathered more than 600 industry leaders and emerging enterprises worldwide, and attracted expert groups from multiple countries and regions.
Making its debut at HKPCA SHOW, IFREE specially brought the X2F dedicated to FPC testing and the X4E suitable for PCBA testing.
The X2F is suitable for bare PCB testing, especially for FPC boards. The flexible material of FPC is prone to deformation and damage during testing. To address this issue, IFREE has independently developed a pressure sensing feedback system, paired with a vacuum adsorption platform, which achieves stable fixation of boards and intelligent pressure regulation during testing, fundamentally avoiding testing damage. The product is equipped with two testing modes:
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Capacitance Testing Method: Suitable for single-layer and double-layer boards, with a high speed of up to 35 steps per second, greatly improving detection efficiency and significantly reducing testing costs; -
Resistance Testing Method: Adopting Kelvin Probe Four-Wire Testing Technology, it accurately measures micro-impedance to meet high-precision testing requirements.
The X4E is a high-end 4-probe flying probe testing equipment equipped with a proximity measurement module, boasting excellent testing performance. It requires no customized testing fixtures and is suitable for small-batch and multi-variety production needs, making it a cost-effective choice that balances precision, efficiency and cost. In the field of PCBA flying probe testing, IFREE holds more than half of the market share in China, establishing itself as a benchmark solution provider in the industry.
As a brand of high-end flying probe testing equipment independently developed by domestic manufacturers, IFREE owns the industry's most widely applied flying probe product portfolio, covering three core fields: PCBA, FPC and semiconductor substrates. Even within the application scope of flying probe testing, the technical barriers are extremely high. The biggest challenge lies in "balancing the compatibility of technical systems and special requirements", and IFREE has achieved breakthroughs through three core strategies:
1. Full-Stack Independent R&D: Leveraging years of structural design experience and testing technology accumulation, IFREE flexibly adapts to different testing environments in structural design; independently develops probe separation and path logic algorithms to support personalized customization of testing requirements; and adopts a modular design architecture to effectively expand the extension of testing applications.
2. R&D Strategy: With the goal of achieving full domestic substitution, IFREE closely follows the equipment leaders in various fields. Through in-depth research, technical decomposition and innovative upgrading, it stands on the shoulders of giants to realize transcendence.
3. Advantage Transformation: Relying on faster R&D project initiation speed and resource integration capabilities, IFREE quickly responds to market demands and forms a unique full-coverage product portfolio.
The Exhibition Concludes, but Innovation Never Stops
With the conclusion of HKPCA SHOW, IFREE's exhibition journey has come to a successful end, but the pace of technological innovation and win-win cooperation has never stopped. IFREE will continue to inject strong impetus into the high-quality development of the electronic circuit industry with professional products and services.