On October 16th, the 141st CEIA Electronic Manufacturing Forum was successfully held at the DoubleTree by Hilton Beijing. As a technological pioneer in the domestic flying probe testing sector, IFREE was invited to attend and deliver a technical presentation. Focusing on cutting-edge industry trends and practical solutions, the sharing session garnered extensive attention from the guests present, injecting new vitality into the exchange of the northern electronic manufacturing industry.
01.Solving Testing Challenges with Real-World Cases
At the event, Mr. Zhou Bin, Marketing Director of IFREE, was invited to take the stage and deliver a presentation, offering an in-depth interpretation of "Flying Probe Testing Application Cases". Unlike superficial theoretical discussions, Mr. Zhou analyzed the practical value of flying probe testing from three core dimensions, drawing on IFREE’s real project experience in serving the consumer electronics, automotive electronics, semiconductor and other sectors in recent years:
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Technical Adaptability: Against the backdrop of the current trend toward "miniaturization and high-density" of electronic components, this section compares the limitations of traditional testing methods and elaborates on how flying probe testing, through its flexible probe design, accurately addresses the testing scenarios of ultra-small components.
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Efficiency Improvement: Relying on intelligent path planning technology, it optimizes the batch PCBA testing process, significantly shortens the overall testing cycle, and provides strong support for efficient detection in mass production scenarios.
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Cost Optimization: Targeting the pain points of testing small and medium-batch orders, the advantage of flying probe testing — "no need for customized fixtures" — helps enterprises reduce upfront investment and model changeover costs.
02.Full-Scenario Product Portfolio: Demonstrating Core Technical Strength
Mr. Zhou elaborated on the core advantages of IFREE’s flying probe product portfolio. Guided by market demands, IFREE has been committed to building a product system that covers diverse customer groups and application scenarios.
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For conventional PCBA testing, it offers the M Series and E Series with 4-probe, 6-probe and 8-probe configurations to meet the testing needs of different PCBAs. In addition, a desktop 2-probe device is launched to cater to miniaturized testing scenarios, featuring space-saving design and user-friendly operation.
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For FPC (Flexible Printed Circuit) testing, the X2F device is introduced, equipped with a vacuum high-suction stage that effectively prevents FPC deformation and displacement during testing, ensuring testing accuracy and stability.
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For high-precision testing scenarios such as semiconductor substrates, the X4S device is launched, supporting high-speed and high-precision testing of ceramic substrates, glass substrates and other materials with its precision four-wire measurement technology.
03.Deepening Technological Expertise to Explore New Industry Opportunities Together
This event served as an important opportunity for IFREE to deepen exchanges with partners in the northern electronic manufacturing industry. Going forward, IFREE will continue to take "technological innovation" as its core driving force, deepen its expertise in the flying probe testing field, provide more high-quality and efficient testing solutions for more customers, and help the electronic manufacturing industry scale new heights!