The CEIA Intelligent Electronics Manufacturing Forum in Chengdu concluded successfully on May 14. IFREE attended the forum with full-scenario flying probe test solutions covering PCBA, FPC and semiconductor substrate fields. The diversified application value of domestic flying probe test technology drew extensive attention from all attendees.
At this grand event, IFREE integrated technical sharing with practical scenario implementation in depth — Mr. Zhou Bin, Marketing Director of IFREE, delivered a keynote speech titled Multifunctional Application Analysis of Flying Probe Test in the Electronics Manufacturing Industry.
As a flying probe supplier offering the widest range of application environments in the industry, IFREE also focuses on core semiconductor testing scenarios and newly launched the X4S flying probe test equipment for semiconductor testing such as wafers and IC substrates. Equipped with a high-precision servo motion control system and ultra-precise test probe architecture, the equipment supports stable testing of micro-pitch, ultra-thin substrates and high-end semiconductor packages. It meets mass production and engineering verification demands of various specifications of wafers and IC substrates, featuring high test accuracy, outstanding stability and wide compatibility. It fully complies with the stringent high-precision and high-reliability testing standards of the semiconductor industry.
In addition, the speech further analyzed the application logic and value of flying probe testing across multiple fields targeting core pain points of the electronics manufacturing industry, covering full scenarios from consumer electronics to aerospace, and provided highly referable solutions for all participants. At the Chengdu forum, many aerospace enterprises and research institutes came for consultation and communication, focusing on the expansion capability of flying probe platforms, equipment maintenance and operation scenarios as well as substrate test application schemes. They expressed high recognition and cooperation intentions towards IFREE's full-scenario flying probe test solutions.
Four Core Technical Highlights Demonstrating the Rising Strength of Domestic Test Equipment
1. Full-Stack Independent R&D — Confidence in Domestic Substitution
100% full-stack independent R&D for core algorithms, motion control, measurement boards and software test platforms; the localization rate of core components exceeds 98%, cutting delivery time by 85%.
2. "Flying Probe Test Plus" Expansion Platform
✅ Modular expansion: expansion modules including barcode reading, flatness inspection, LED color/brightness testing, parallel programming, RF testing, boundary scan, power-on test and open pin test, flexibly meeting future upgrading demands.
✅ Ecosystem compatibility: open API interfaces for connection with MES/ERP systems to form a closed-loop intelligent manufacturing system.
3. Ultra-Fast Programming for Doubled Efficiency
With AI intelligent assistance, CAD/BOM files can be imported with one click to automatically generate test programs, lifting efficiency by over 85%.
4. Ultra-Low Learning Cost to Lower Entry Barriers
Full Chinese graphical interface without coding requirements; low-cost operation delivers greater productivity.
As a domestic enterprise specializing in the manufacturing of high-end test equipment, IFREE has deeply cultivated the flying probe test sector and offers test solutions covering PCBA, FPC and semiconductor substrates. With over 50% of its staff dedicated to R&D and more than 240 accumulated intellectual property rights, the company continuously drives technological innovation and industrial implementation.
The exchanges and displays at this conference also enabled IFREE to more accurately capture industry demands and development trends. In the future, IFREE will keep optimizing flying probe test technologies and solutions, enrich the extended functions of "Flying Probe Test Plus", and provide full-lifecycle technical support relying on its global multi-site service network. The domestically produced flying probe test equipment built on full-stack independent R&D will empower more electronics manufacturers to cut costs and boost efficiency.